000			02439nab a2200241 4500
005			20260525051539.0
008			260224s2014 xxu ing
041			_aInglés
100	1		_aNewman, Jeffrey S. _955559
100	1		_aYee, Geary G. _955560
100	1		_aSu, Paul _946512
100	1		_aXin, Yibing _955561
100	1		_aRen, Ning _955562
245	0	0	_aSmoke Damage Potentials in Industrial Fire Applications
260			_cnov. 2014
270			_a06/12/2016 ; 27/07/2016
300			_a21 p. ; 1437-1458
520			_aTranscripción del resúmen realizada por el autor: A methodology is presented for the evaluation of smoke damage contours through the coupling of smoke damage functions, deposition profiles and damage thresholds. Previously developed smoke damage functions and deposition velocities are used to illustrate "ar-field"smoke damage potentials both for materials representative of semiconductor fabrication facilities as well as large warehouse storage applications. For semiconductor fabrication, smoke damage associated with leakage current (LC) is important, while smoke staining is of primary interest in warehouse storage. Smoke deposition velocities, a key component to quantifying smoke deposition profiles, were determined in a small (1.0 m3) and large (1,200 m3) enclosure. Both enclosures resulted in comparable values. The velocities ranged from 1.2 to 7.3 ×. 10-4 m/s. To determine smoke damage potential contours for semiconductor fabrication facilities, electronic circuit board targets were used. Smoke damage was quantified by LC (i.e., shorting). The average normalized LC values for polyvinylchloride, polycarbonate, and nylon ranged from 0.72 to 6.1 ×.10-4 A m2/g. For warehouse storage facilities, filter targets were used. Smoke damage was quantified by brightness change and odor (i.e., volatile organic compounds, VOC) measurements on the targets. Representative materials were liner board, polystyrene, and polymethyl methacrylate. The smoke damage threshold value for brightness change was 0.012 g/m2 and for odor was 0.025 g VOC/m2. Resulting contours showed strong radial dependency with distance from the fire/smoke source. Smoke damage reached ~28 m for semiconductor fabrication facilities, while for warehouse storage facilities, it was up to 100 m.
581			_a6
773	0		_tFire Technology _g50
942			_cARTICULO _2ddc
999			_c189683 _d189683