<?xml version="1.0" encoding="UTF-8"?>
<record
    xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"
    xsi:schemaLocation="http://www.loc.gov/MARC21/slim http://www.loc.gov/standards/marcxml/schema/MARC21slim.xsd"
    xmlns="http://www.loc.gov/MARC21/slim">

  <leader>02038nab a2200205   4500</leader>
  <controlfield tag="005">20260520000935.0</controlfield>
  <controlfield tag="008">260224s2010    xxu                      </controlfield>
  <datafield tag="245" ind1="0" ind2="0">
    <subfield code="a">Effect of different curing agents on cure reaction and exposure resistance of phenolic-epoxy resins in hot acid solutions</subfield>
  </datafield>
  <datafield tag="260" ind1=" " ind2=" ">
    <subfield code="a"></subfield>
    <subfield code="b"></subfield>
    <subfield code="c">jul. 2010</subfield>
  </datafield>
  <datafield tag="270" ind1=" " ind2=" ">
    <subfield code="a">02/08/2010 ; 02/08/2010</subfield>
  </datafield>
  <datafield tag="300" ind1=" " ind2=" ">
    <subfield code="a">9 p. ; 075001</subfield>
  </datafield>
  <datafield tag="520" ind1=" " ind2=" ">
    <subfield code="a">Transcripci&#xF3;n del resumen del autor. Linear phenolic-epoxy polymers were cured with diaminodi-phenyl sulfone (DDS), metaphenylene diamine (m-DPA), and phenolic aldehyde amine (PAA), respectively, to prepare several anti-corrosion materials that are coating components. The effect of different curing agents on energy of activation (Ea and glass transition temperature (Tg) of polymers was investigated using differential scanning calorimetry (DSC). Ea of phenolic-epoxy /DDS is higher than that of phenolic-epoxy/PAA, and lower than that of phenolic-epoxy / m-DPA. The three anti-corrosion materials were immersed in 10% sulfuric acid (H2SO4) solution at 80&#xB0;C for 800 h. Tg of phenolic-epoxy/DDS material varies very little before and after acid immersion testing, while Tg of phenolic-epoxy/PAA material drastically decreases after the acid immersion test. A gravimetric liquid sorption experiment indicates that weight loss of phenolic-epoxy /DDS material is the smallest among three anti-corrosion materials. X-ray photoelectron spectroscopy (XPS) analysis demonstrates that the carbon-to-oxygen (C/O) ratio of phenolic-epoxy/DDS material after exposure testing is higher than that of phenolic-epoxy/m-DPA material and phenolic-epoxy/PAA material. The high Tg, high C/O ratio, and low weight loss of phenolic-epoxy /DDS material as a coating component during exposure are connected directly with the strong corrosion resistance of the coating.</subfield>
  </datafield>
  <datafield tag="581" ind1=" " ind2=" ">
    <subfield code="a">7</subfield>
  </datafield>
  <datafield tag="773" ind1="0" ind2=" ">
    <subfield code="t">Corrosion</subfield>
    <subfield code="g">66</subfield>
  </datafield>
  <datafield tag="942" ind1=" " ind2=" ">
    <subfield code="c">ARTICULO</subfield>
  </datafield>
  <datafield tag="100" ind1="1" ind2=" ">
    <subfield code="a">Wang, Z.</subfield>
    <subfield code="9">46101</subfield>
  </datafield>
  <datafield tag="100" ind1="1" ind2=" ">
    <subfield code="a">Han, E.</subfield>
    <subfield code="9">46102</subfield>
  </datafield>
  <datafield tag="100" ind1="1" ind2=" ">
    <subfield code="a">Liu, F.</subfield>
    <subfield code="9">46103</subfield>
  </datafield>
  <datafield tag="999" ind1=" " ind2=" ">
    <subfield code="c">175607</subfield>
    <subfield code="d">175607</subfield>
  </datafield>
  <datafield tag="952" ind1=" " ind2=" ">
    <subfield code="0">0</subfield>
    <subfield code="1">0</subfield>
    <subfield code="4">0</subfield>
    <subfield code="7">0</subfield>
    <subfield code="9">243426</subfield>
    <subfield code="a">BAAB</subfield>
    <subfield code="b">BAAB</subfield>
    <subfield code="d">2026-03-05</subfield>
    <subfield code="j">200047502</subfield>
    <subfield code="l">0</subfield>
    <subfield code="p">200047502</subfield>
    <subfield code="r">2026-03-05 18:55:50</subfield>
    <subfield code="w">2026-03-05</subfield>
    <subfield code="y">ARTICULO</subfield>
  </datafield>
</record>
